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- Nachgewiesen in: USPTO Patent Applications
- Sprachen: English
- Document Number: 20240094292
- Publication Date: March 21, 2024
- Appl. No: 17/948703
- Application Filed: September 20, 2022
- Assignees: Inventec (Pudong) Technology Corporation (Taipei City, CN)
- Claim: 1. A method of performing boundary scan test on pin through a test point, comprising: obtaining component information of an electronic component connected to a target connector, wherein the target connector and the electronic component are disposed on a circuit board; when an under-test pin of the target connector is determined to be unable to perform a boundary scan test based on the component information, searching a test point connected to and closest to the under-test pin; connecting to the test point and a testing device; controlling the testing device to transmit a test signal to the target connector, and then receive a result signal generated by the circuit board from the target connector in response to the test signal; and comparing an expected result corresponding to the test signal and the result signal to generate a test result of the target connector.
- Claim: 2. The method of performing boundary scan test on pin through test point according to claim 1, further comprising: when another under-test pin of the target connector is determined to be able to perform the boundary scan test based on the component information, selecting an input/output point of the electronic component corresponding to the another under-test pin based on the component information, and connecting the testing device to the input/output point.
- Claim: 3. The method of performing boundary scan test on pin through test point according to claim 1, wherein the step of determining whether the under-test pin of the target connector is able to perform the boundary scan test based on the component information, comprises: when determined that the electronic component is directly connected to the under-test pin and a connection pin connected to the under-test pin is corresponding to a boundary scan cell in the electronic component based on the component information, determining that the under-test pin is able to perform the boundary scan test, otherwise, determining that the under-test pin is unable to perform the boundary scan test.
- Claim: 4. The method of performing boundary scan test on pin through test point according to claim 1, wherein the step of determining whether the under-test pin of the target connector is able to perform the boundary scan test based on the component information, comprises: determining that the under-test pin is unable to perform the boundary scan test when the under-test pin is determined to be able to perform the boundary scan test but the test result of the under-test pin does not match an expected result.
- Claim: 5. The method of performing boundary scan test on pin through test point according to claim 1, wherein the step of searching the test point connected to and closest to the under-test pin, comprises: obtaining test-point location information of each test point on a connection line between the under-test pin and the electronic component, and selecting one of the test point connected to the under-test pin and closest to the under-test pin based on the test-point location information.
- Claim: 6. The method of performing boundary scan test on pin through test point according to claim 5, wherein the step of searching the test point connected to and closest to the under-test pin, comprises: when failed to obtain the test-point location information on the connection line between the under-test pin and the electronic component, obtaining soldering pad information of a soldering pad corresponding to the target connector, and obtaining the test point of the soldering pad connected to the under-test pin based on the soldering pad information.
- Claim: 7. A system of performing boundary scan test on pin through test point, wherein the system is configured to test a circuit board and comprises: a testing device; and a controlling device comprising: an information obtaining module, configured to obtain component information of an electronic component connected to a target connector, wherein the target connector and the electronic component are disposed on the circuit board; a mode determining module, configured to determine whether an under-test pin of the target connector is able to perform a boundary scan test based on the component information; a test point selecting module, configured to search a test point which is connected to and closest to the under-test pin when the mode determining module determines that the under-test pin is unable to perform the boundary scan test; a test point connecting module, configured to connect the test point to the testing device; a test control module, configured to control the testing device to transmit a test signal to the target connector and then receive a result signal generated by the circuit board from the target connector in response to the test signal; and a result determining module, configured to compare an expected result corresponding to the test signal and the result signal to generate a test result.
- Claim: 8. The system of performing boundary scan test on pin through test point according to claim 7, wherein when the mode determining module determines that another under-test pin of the target connector is able to perform the boundary scan test, the test point selecting module selects an input/output point of the electronic component corresponding to the another under-test pin based on the component information, the test point connecting module is configured to connect the testing device to the input/output point.
- Claim: 9. The system of performing boundary scan test on pin through test point according to claim 7, wherein when the mode determining module determines that the electronic component is directly connected to the under-test pin and a connection pin of the electronic component connected to the under-test pin is corresponding to a boundary scan cell in the electronic component based on the component information, the mode determining module determines that the under-test pin is able to perform the boundary scan test, otherwise, the mode determining module determines that the under-test pin is unable to perform the boundary scan test.
- Claim: 10. The system of performing boundary scan test on pin through test point according to claim 7, wherein the mode determining module determines that the under-test pin is unable to perform the boundary scan test when the mode determining module determines that the under-test pin is able to perform the boundary scan test but the test result of the under-test pin does not match an expected result.
- Claim: 11. The system of performing boundary scan test on pin through test point according to claim 7, wherein the test point selecting module is configured to obtain test-point location information of each test point on a connection line between the under-test pin and the electronic component, and selecting one of the test point connected to the under-test pin and closest to the under-test pin based on the test-point location information.
- Claim: 12. The system of performing boundary scan test on pin through test point according to claim 11, wherein the test point selecting module is configured to obtain soldering pad information of a soldering pad corresponding to the target connector and obtain the test point of the soldering pad connected to the under-test pin based on the soldering pad information when the test point selecting module fails to obtain the test-point location information.
- Claim: 13. A system of performing boundary scan test on pin through test point, wherein the system is configured to test a circuit board and comprises: a controlling device comprising: an information obtaining module, configured to obtain component information of an electronic component connected to a target connector, the target connector and the electronic component are disposed on the circuit board; a mode determining module, configured to determine whether an under-test pin of the target connector is able to perform the boundary scan test, based on the component information; and a test point selecting module, wherein when the mode determining module determines that the under-test pin is unable to perform the boundary scan test, the test point selecting module searches a test point connected to and closest to the under-test pin; and a testing device, comprising: a test point connecting module is configured to connect the test point to the testing device; a test control module, configured to transmit a test signal to the target connector, and then receive a result signal generated by the circuit board from the target connector in response to the test signal; and a result determining module configured to compare an expected result corresponding to the test signal and the result signal to generate a test result.
- Claim: 14. The system of performing boundary scan test on pin through test point according to claim 13, wherein when the mode determining module determines that another under-test pin of the target connector is able to perform the boundary scan test, the test point selecting module selects an input/output point of the electronic component corresponding to the another under-test pin based on the component information, and the test point connecting module connects the testing device to the selected input/output point.
- Claim: 15. The system of performing boundary scan test on pin through test point according to claim 13, wherein when the mode determining module determines that the electronic component is directly connected to the under-test pin and a connection pin of the electronic component connected to the under-test pin is corresponding to a boundary scan cell in the electronic component based on the component information, the mode determining module determines that the under-test pin is able to perform the boundary scan test, otherwise, the mode determining module determines that the under-test pin is unable to perform the boundary scan test.
- Claim: 16. The system of performing boundary scan test on pin through test point according to claim 13, wherein the mode determining module determines that the under-test pin is unable to perform the boundary scan test when the mode determining module determines that the under-test pin is able to perform the boundary scan test but the test result of the under-test pin does not match an expected result.
- Claim: 17. The system of performing boundary scan test on pin through test point according to claim 13, wherein the test point selecting module is configured to obtain test-point location information of each test point on a connection line between the under-test pin and the electronic component, and selecting one of the test point connected to the under-test pin and closest to the under-test pin based on the test-point location information.
- Claim: 18. The system of performing boundary scan test on pin through test point according to claim 17, wherein the test point selecting module is configured to obtain soldering pad information of a soldering pad corresponding to the target connector and obtain the test point of the soldering pad connected to the under-test pin based on the soldering pad information when the test point selecting module fails to obtain the test-point location information.
- Current International Class: 01
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